Thermal Plates -- The Heat is On

Bi-metal technology, used by PDI, involves placing a photopolymer layer on top of a thin layer of copper that sits on top of a thin layer of aluminum or stainless steel base. After the plate is exposed to the heat in the platesetter, the developing process removes the copper in the non-imaging areas. In the last development step the polymer stencil is dissolved and removed. The result is a plate with press dot sizes that are the same as the original film.