xpedx Launches Expanded Network of Package Design Centers
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CINCINNATI—Feb. 21, 2011—xpedx announced a new network of seven Package Design Centers with the opening of centers in the San Francisco Bay Area and Rochester, NY, and the expansion of existing design centers in metropolitan Chicago, Detroit, Kansas City, Pittsburgh and Juarez, Mexico. xpedx provides total packaging solutions for manufacturers, brand owners/marketers and other businesses.
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